Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004388
Kind Code:
A1
Abstract:
[Problem] To obtain, using a compact and inexpensive device, a highly accurate image including multi-wavelength information. [Solution] This solid-state imaging device comprises: a sensor; and a signal processing circuit. A plurality of regions: include light-receiving elements arranged in a two-dimensional array along a first direction and a second direction intersecting the first direction; are disposed along the first direction; and each receive light of a different wavelength or input light of a different wavelength. The signal processing circuit obtains, on the basis of a signal obtained by the light-receiving element belonging to each of the plurality of regions, an image in which information of an object moving along the second direction has been corrected.
Inventors:
ITAGAKI KEIICHI (JP)
Application Number:
PCT/JP2023/017598
Publication Date:
January 04, 2024
Filing Date:
May 10, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N23/54; H04N23/60
Domestic Patent References:
| WO2021100426A1 | 2021-05-27 |
Foreign References:
| JP2017208813A | 2017-11-24 | |||
| US20180204863A1 | 2018-07-19 | |||
| JP2021048464A | 2021-03-25 | |||
| JP2013003159A | 2013-01-07 | |||
| JP2019129178A | 2019-08-01 |
Attorney, Agent or Firm:
MIYAJIMA Manabu (JP)
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