Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084880
Kind Code:
A1
Abstract:
The present invention suppresses mixing of light. The present invention provides a solid-state imaging device that comprises a pixel array part in which a plurality of pixels including a pixel that is provided with a plurality of photoelectric conversion elements with respect to one on-chip lens are two-dimensionally arranged, wherein: the pixels each comprise a control member; the control member is composed of a first member which has a first refractive index and a second member which has a second refractive index that is lower than the first refractive index; the on-chip lens, the first member, the second member and the photoelectric conversion elements are sequentially stacked in this order; the second member has a first surface that faces the first member, and a second surface that faces the photoelectric conversion elements; the first surface comprises a projected part which protrudes toward the on-chip lens, or a recessed part which is recessed toward the photoelectric conversion elements; and in cases where the first surface comprises the recessed part, the surface is provided with a plurality of relief parts.
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Inventors:
NONAKA SHIN (JP)
Application Number:
PCT/JP2023/034018
Publication Date:
April 25, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N25/70
Domestic Patent References:
WO2018088281A1 | 2018-05-17 |
Foreign References:
JP2015228467A | 2015-12-17 | |||
JP2010238726A | 2010-10-21 | |||
JP2022121757A | 2022-08-22 | |||
JP2019160830A | 2019-09-19 | |||
JP2016057335A | 2016-04-21 | |||
JP2010245292A | 2010-10-28 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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