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Title:
SOLID PARTICLES USED FOR ELECTROLYTIC POLISHING OF METAL PART
Document Type and Number:
WIPO Patent Application WO/2023/124977
Kind Code:
A1
Abstract:
Disclosed are solid particles used for electrolytic polishing of a metal part; said solid particles have a porous structure; a solid particle contains an amino group; the interior and/or surface of the pore channel of the solid particulate matter contains an electrolyte. Also disclosed by the present invention is a method for application of the solid particles to perform solid electrolytic polishing of a metal part. Compared with physical polishing and chemical polishing, the solid particles for electrolytic polishing of the metal part can fully polish sections of the part that are inconvenient to fully polish, and large amounts of chemical oxidation agent and electrolyte solution are not needed during the polishing process, and the invention is environmentally friendly and high in safety. The particles can be regenerated after being used for a period of time such that the service life is significantly prolonged and the cost is reduced.

Inventors:
PANG HAO (CN)
LIAO BING (CN)
HONG PEIPING (CN)
YU YUE (CN)
Application Number:
PCT/CN2022/138716
Publication Date:
July 06, 2023
Filing Date:
December 13, 2022
Export Citation:
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Assignee:
INST OF CHEMICAL ENGINEERING GUANGDONG ACADEMY OF SCIENCES (CN)
International Classes:
C25F3/16
Domestic Patent References:
WO2021156531A12021-08-12
Foreign References:
CN114908410A2022-08-16
CN114481286A2022-05-13
CN114908409A2022-08-16
CN112534088A2021-03-19
CN1646649A2005-07-27
CN111032929A2020-04-17
US20060169674A12006-08-03
CN107207910A2017-09-26
RU2700226C12019-09-13
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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