Title:
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/080833
Kind Code:
A1
Abstract:
The present invention provides a slurry composition for chemical mechanical polishing and a manufacturing method therefor, wherein the slurry composition is capable of achieving a high polishing rate for low dielectric constant films relative to the abrasive particle content, and improving the ratio of the polishing rate of low dielectric constant films to the polishing rate of oxide films. In addition, the invention provides a slurry composition for chemical mechanical polishing and a manufacturing method therefor, wherein the slurry composition is capable of achieving a high polishing rate for low dielectric constant films relative to the abrasive particle content, and improving the ratio of the polishing rate of low dielectric constant films to the polishing rate of nitride films. Moreover, the invention provides a slurry composition for chemical mechanical polishing and a manufacturing method therefor, wherein the slurry composition is capable of achieving a high polishing rate for low dielectric constant films relative to the abrasive particle content, and improving the ratio of the polishing rate of low dielectric constant films to the polishing rate of silicon carbonitride (SiCN) films. Furthermore, the invention provides a slurry composition for chemical mechanical polishing and a manufacturing method therefor, wherein the slurry composition controls the polishing selectivity ratio of low dielectric constant films to nitride films to a low level, thereby achieving excellent planarity of the polishing target and control defects such as dishing, erosion, and scratches.
Inventors:
KIM SEOK JOO (KR)
KIM MYEONG JIN (KR)
KIM MYEONG JIN (KR)
Application Number:
PCT/KR2023/015847
Publication Date:
April 18, 2024
Filing Date:
October 13, 2023
Export Citation:
Assignee:
SOULBRAIN CO LTD (KR)
International Classes:
C09G1/02; C09K3/14; H01L21/306; H01L21/3105
Foreign References:
| KR20220029512A | 2022-03-08 | |||
| KR20200128741A | 2020-11-16 | |||
| KR20100083492A | 2010-07-22 | |||
| KR101513606B1 | 2015-04-20 | |||
| KR20220070026A | 2022-05-27 |
Attorney, Agent or Firm:
JIDAM IP LAW FIRM (KR)
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