Title:
SILICON WAFER CUTTING APPARATUS AND SILICON WAFER CUTTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/138193
Kind Code:
A1
Abstract:
A silicon wafer cutting apparatus and a silicon wafer cutting device. The silicon wafer cutting apparatus comprises a cutting assembly (1) and a spraying assembly (2). The cutting assembly (1) comprises a wire mesh (10) and at least two main rollers (11), and every two main rollers (11) are arranged at intervals. The wire mesh (10) is wound on the roller surface of the main roller (11) along the axial direction of the main roller (11). The wire mesh (10) is located below the silicon rod (3) for cutting the silicon rod (3) along the direction of cutting the silicon rod (3). The plane where the wire mesh (10) between the two main rollers (11) is located is perpendicular to the direction of cutting the silicon rod (3), and part of the wire mesh (10) is in contact with the silicon rod (3) and is used for cutting the silicon rod (3), and the part of the wire mesh (10) constitutes a working wire mesh (100). The spraying assembly (2) is located below the working wire mesh (100) and is used for spraying the working wire mesh (100).
Inventors:
WANG XIAOFENG (CN)
FAN XIN (CN)
YANG BIHONG (CN)
FAN XIN (CN)
YANG BIHONG (CN)
Application Number:
PCT/CN2022/132054
Publication Date:
July 27, 2023
Filing Date:
November 15, 2022
Export Citation:
Assignee:
LUFENG LONGI SILICON MAT CO LTD (CN)
International Classes:
B28D5/00; B28D5/04
Foreign References:
| CN216884680U | 2022-07-05 | |||
| CN101797713A | 2010-08-11 | |||
| CN203863859U | 2014-10-08 | |||
| JP2001328054A | 2001-11-27 | |||
| JPH0985737A | 1997-03-31 | |||
| CN210999505U | 2020-07-14 |
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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