Title:
SILICON ALLOY, AND THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC CONVERSION MODULE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2023/162844
Kind Code:
A1
Abstract:
The present invention provides at least one of: a silver-barium-silicon silicon alloy that has both a large Seebeck coefficient at low temperatures and high density; a thermoelectric material including the silicon alloy; a thermoelectric element including the thermoelectric material; and a thermoelectric module including the thermoelectric element. The silver-barium-silicon silicon alloy includes at least one group 14 element selected from among germanium, tin, and lead, and the content of the group 14 element is less than 9 at%.
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Inventors:
KODA YOICHIRO (JP)
AKIIKE RYO (JP)
MESUDA MASAMI (JP)
AKIIKE RYO (JP)
MESUDA MASAMI (JP)
Application Number:
PCT/JP2023/005377
Publication Date:
August 31, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
TOSOH CORP (JP)
International Classes:
H10N10/851; C04B35/58; C22C30/04; H02N11/00
Foreign References:
| JP2006057124A | 2006-03-02 | |||
| JP2021072399A | 2021-05-06 | |||
| JP2016213373A | 2016-12-15 | |||
| JP2021181397A | 2021-11-25 |
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