Title:
SHEET PROVIDED WITH HEAT INSULATING LAYER AND ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2023/248905
Kind Code:
A1
Abstract:
This sheet is provided with a heat insulating layer and an adhesive layer. The bulk strength of the heat insulating layer after addition of thermal history in which a temperature is risen from 25℃ to 200℃ at a temperature rising rate of 47℃/min and then risen from 200℃ to 260℃ at a temperature rising rate of 38℃/min is larger than the peeling strength of 90° of the adhesive layer after the addition of the above thermal history.
Inventors:
MATSUBARA NOZOMI (JP)
HIGASHIUCHI TOMOKO (JP)
YOKOTA HIROSHI (JP)
TSUDA YOSHIHIRO (JP)
FURUKAWA NAOKI (JP)
HIGASHIUCHI TOMOKO (JP)
YOKOTA HIROSHI (JP)
TSUDA YOSHIHIRO (JP)
FURUKAWA NAOKI (JP)
Application Number:
PCT/JP2023/022124
Publication Date:
December 28, 2023
Filing Date:
June 14, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B32B27/00; C09J7/38; C09J201/00; F16L59/02; H01L21/50
Domestic Patent References:
| WO2016117646A1 | 2016-07-28 | |||
| WO2020246351A1 | 2020-12-10 |
Foreign References:
| JPH11293208A | 1999-10-26 | |||
| JPH11116644A | 1999-04-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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