Title:
SENSOR MODULE AND CASE UNIT
Document Type and Number:
WIPO Patent Application WO/2021/200557
Kind Code:
A1
Abstract:
A sensor module according to one aspect of the present technology comprises a sensor element, a first case, a second case, and an intermediate layer. The first case has an opening end section and accommodates the sensor element. The second case has a junction surface that is welded to the opening end section. The intermediate layer has light-reflective properties formed along the outer peripheral edge of a region where the opening end section opposes the junction surface.
Inventors:
TANAKA HARUKI (JP)
Application Number:
PCT/JP2021/012579
Publication Date:
October 07, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G03B17/02; B29C65/16; G01D11/24; G01D11/30; G02B7/02; G02B7/28; G03B15/00; G03B17/08; H04N5/225
Domestic Patent References:
| WO2017212710A1 | 2017-12-14 |
Foreign References:
| JP2018173431A | 2018-11-08 | |||
| JP2009078526A | 2009-04-16 | |||
| JP2010160404A | 2010-07-22 | |||
| JP2020004366A | 2020-01-09 | |||
| JP2018173431A | 2018-11-08 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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