SENSOR CHIP PACKAGING STRUCTURE AND METHOD, AND PCB SUBSTRATE AND MICROFLUIDIC DETECTION DEVICE

Title:

SENSOR CHIP PACKAGING STRUCTURE AND METHOD, AND PCB SUBSTRATE AND MICROFLUIDIC DETECTION DEVICE

Document Type and Number:

WIPO Patent Application WO/2024/077540

Kind Code:

A1

Abstract:

Provided in the present invention are a sensor chip packaging structure and method, and a PCB substrate. The sensor chip packaging structure comprises: a packaging substrate; and a sensor chip, which comprises a first surface and a second surface that are opposite each other, wherein the first surface is covered with a sensing portion, the second surface is attached to the packaging substrate, and the sensor chip is electrically connected to the packaging substrate. The sensor chip packaging structure further comprises: a plastic package body, which covers the sensor chip, wherein the surface of the plastic package body opposite the sensing portion is provided with an opening, so as to cover the sensor chip and expose at least a partial region of the sensing portion. By using the fluid characteristics of the plastic package body before forming, the partial or entire sensing portion can be selectively exposed after the plastic package body is solidified, such that the sensing portion realizes contact with an external detected object, thereby simplifying the complexity of the packaging structure, facilitating the obtainment of tested data, and obtaining better signal response. Thus, the available area of a chip is maximized, and lightweight of the packaging structure is also realized.

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Inventors:

TAN YANGSHENG (CN)
ZHANG YUNING (CN)
YUN QUANXIN (CN)
LI YUXIANG (CN)
DONG YULIANG (CN)
ZHANG WENWEI (CN)
XU XUN (CN)

Application Number:

PCT/CN2022/125046

Publication Date:

April 18, 2024

Filing Date:

October 13, 2022

Export Citation:

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Assignee:

BGI SHENZHEN (CN)

International Classes:

H01L23/31; B01L3/00

Foreign References:

US9670445B1	2017-06-06
US20150041324A1	2015-02-12
CN213579899U	2021-06-29
CN104851853A	2015-08-19

Attorney, Agent or Firm:

IP MARCH (CN)

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