Title:
SEMICONDUCTOR SUBSTRATE PROCESSING LIQUID
Document Type and Number:
WIPO Patent Application WO/2024/096077
Kind Code:
A1
Abstract:
Provided is a semiconductor substrate processing liquid having superior ability in removing organic matter on a substrate. One aspect of the present disclosure pertains to a semiconductor substrate processing liquid containing an aromatic solvent (component A) and an organic acid (component B). The component A includes an aromatic ether.
Inventors:
YAMADA KOUHEI
Application Number:
PCT/JP2023/039502
Publication Date:
May 10, 2024
Filing Date:
November 01, 2023
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
H01L21/304; C11D1/22; C11D3/20; C11D3/34; C11D3/43; C11D7/26; C11D7/34; C11D7/50
Domestic Patent References:
| WO2018021273A1 | 2018-02-01 | |||
| WO2019009054A1 | 2019-01-10 |
Foreign References:
| US20030030030A1 | 2003-02-13 | |||
| JP2019087543A | 2019-06-06 | |||
| JP2007191524A | 2007-08-02 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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