Title:
SEMICONDUCTOR SUBSTRATE, AND METHOD AND DEVICE FOR PRODUCING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/084634
Kind Code:
A1
Abstract:
A semiconductor substrate comprising: a template substrate (TS) having a mask pattern (6) arranged in a first direction and that includes a mask portion (5) arranged and a first opening portion (K1); and a first semiconductor part (8A) positioned above the template substrate and including a nitride semiconductor. The first semiconductor part (8A) has: a first protrusion (R1) extending from the first seed region (S1) positioned under the first opening portion to a position higher than the upper surface (5i) of the mask portion; a first base portion (B1) positioned above the first protrusion; and a first wing portion (F1) that is connected to the first base portion and that is positioned on a gap (JD), separated from the mask portion.
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Inventors:
KAMIKAWA TAKESHI (JP)
KOBAYASHI TOSHIHIRO (JP)
SUDA NOBORU (JP)
OGURA HIROYUKI (JP)
SEIDA MITSUNARI (JP)
KOBAYASHI TOSHIHIRO (JP)
SUDA NOBORU (JP)
OGURA HIROYUKI (JP)
SEIDA MITSUNARI (JP)
Application Number:
PCT/JP2022/038988
Publication Date:
April 25, 2024
Filing Date:
October 19, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L21/205
Domestic Patent References:
| WO2022145454A1 | 2022-07-07 | |||
| WO2020105362A1 | 2020-05-28 | |||
| WO2022181686A1 | 2022-09-01 | |||
| WO2009009612A2 | 2009-01-15 |
Foreign References:
| JP2019064873A | 2019-04-25 | |||
| JP2017535051A | 2017-11-24 | |||
| JP2015508941A | 2015-03-23 | |||
| JP2002289539A | 2002-10-04 | |||
| JP2019502273A | 2019-01-24 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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