Title:
SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/082348
Kind Code:
A1
Abstract:
Disclosed in embodiments of the present disclosure are a semiconductor packaging structure and a manufacturing method. The semiconductor packaging structure comprises: a first packaging structure comprising a substrate and an interposer, wherein the interposer comprises a first surface and a second surface arranged opposite to each other, at least one side of the second surface is provided with a first lead wire bond pad, the first lead wire bond pad protrudes from the second surface, and the interposer is connected to the substrate by means of the first lead wire bond pad; and a second packaging structure located on the first surface of the interposer and connected to the interposer.
Inventors:
TANG YANFEI (CN)
Application Number:
PCT/CN2022/129962
Publication Date:
April 25, 2024
Filing Date:
November 04, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/28; H01L23/31; H01L23/488; H01L23/498; H01L25/16
Foreign References:
| US20100072593A1 | 2010-03-25 | |||
| CN114639666A | 2022-06-17 | |||
| CN109727944A | 2019-05-07 | |||
| CN112885807A | 2021-06-01 | |||
| CN208240665U | 2018-12-14 | |||
| US20190287939A1 | 2019-09-19 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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