Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/101442
Kind Code:
A1
Abstract:
A semiconductor package according to an embodiment comprises: an insulation layer; a first electrode unit disposed on the insulation layer; a penetration electrode penetrating the insulation layer and electrically connected to the first electrode unit; a reinforcement unit disposed within the insulation layer; a connection unit disposed on the first electrode unit; and a chip mounted on the connection unit, wherein at least a portion of the reinforcement unit vertically overlaps the chip and is not connected to the penetration electrode.
Inventors:
YOO HO DOL (KR)
LEE DONG KEON (KR)
CHOE YU LIM (KR)
LEE DONG KEON (KR)
CHOE YU LIM (KR)
Application Number:
PCT/KR2022/019268
Publication Date:
June 08, 2023
Filing Date:
November 30, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L23/00; H01L23/498; H05K1/11; H05K3/46
Foreign References:
| US20130271929A1 | 2013-10-17 | |||
| KR20140042604A | 2014-04-07 | |||
| KR20160127226A | 2016-11-03 | |||
| KR20090029571A | 2009-03-23 | |||
| KR20110029465A | 2011-03-23 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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