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Patent Searching and Data


Title:
SEMICONDUCTOR LIGHT-RECEIVING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/218698
Kind Code:
A1
Abstract:
A semiconductor light-receiving element equipped with a surface (1a) on which light is incident, a first semiconductor layer (21) of a first conductive type, a second semiconductor layer (22) of the first conductive type which has greater bandgap energy than does the first semiconductor layer (21) and is layered on the first semiconductor layer (21) on the surface (1a) side of the first semiconductor layer (21), a doping region (30) which has a second conductive type different from the first conductive type and is formed so as to extend from the surface (1a) toward the second semiconductor layer (22) side so as to at least reach the interior of the second semiconductor layer (22), wherein: the thickness (T22) of the second semiconductor layer (22) in a first direction (Z) which intersects said surface (1a) is less than the thickness of the first semiconductor layer (21) in the first direction (Z); the doping region (30) includes a plurality of sections (31) which face one another with a gap (30g) interposed therebetween when viewed from the first direction (Z); and the width (G30) of the gap (30g) is greater than the thickness (T22) of the second semiconductor layer (22) in the first direction (Z).

Inventors:
TAGUCHI KEIKI (JP)
ISHIHARA HAJIME (JP)
Application Number:
PCT/JP2023/001523
Publication Date:
November 16, 2023
Filing Date:
January 19, 2023
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L31/10
Foreign References:
JP2010056147A2010-03-11
JP2001177142A2001-06-29
JP2009206499A2009-09-10
JP2012060077A2012-03-22
JP2014110380A2014-06-12
US20120043584A12012-02-23
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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