Title:
SEMICONDUCTOR LIGHT-EMITTING ELEMENT, SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/085108
Kind Code:
A1
Abstract:
A semiconductor light-emitting element (1) emits light from a front end surface (1F) and comprises a semiconductor laminate (1S) having a waveguide, a first P-side electrode (71), and a pad electrode (73). The semiconductor light-emitting element (1) has: a front bottom part (L1) that is the upper surface of the semiconductor light-emitting element (1), that extends rearward from the front end surface (1F) above the waveguide of the semiconductor light-emitting element (1), and that does not have the pad electrode (73) disposed thereon; a rear bottom part (L2) disposed rearward of the front bottom part (L1); a front projection part (H1) that is disposed between the front bottom part (L1) and the rear bottom part (L2) and that projects upward relative to the front bottom part (L1) and the rear bottom part (L2); and a rear projection part (H2) that is disposed rearward of the rear bottom part (L2) and that projects upward relative to the front bottom part (L1) and the rear bottom part (L2). The rear projection part (H2) includes at least a portion of the pad electrode (73).
Inventors:
NAGAI HIROKI
NAKATANI TOUGO
KUNOH YASUMITSU
YAMADA ATSUSHI
ARAKI TSUYOSHI
NAKATANI TOUGO
KUNOH YASUMITSU
YAMADA ATSUSHI
ARAKI TSUYOSHI
Application Number:
PCT/JP2023/037374
Publication Date:
April 25, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
NUVOTON TECH CORPORATION JAPAN (JP)
International Classes:
H01S5/042; H01S5/023; H01S5/0237; H01S5/028; H01S5/22
Foreign References:
| JP2012079967A | 2012-04-19 | |||
| JP2010028020A | 2010-02-04 | |||
| JP2014183120A | 2014-09-29 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
Download PDF: