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Title:
SEMICONDUCTOR LASER DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/058087
Kind Code:
A1
Abstract:
This semiconductor laser device comprises a substrate that has a substrate surface, a semiconductor laser element that is provided on the substrate surface, and a translucent sealing resin that seals the semiconductor laser element. The sealing resin has a sealing surface that faces the same side as the substrate surface, and a first sealing end surface that intersects the sealing surface. The sealing resin includes a diffusion material that diffuses light. The semiconductor laser element includes a first light emitting surface that emits laser light toward the first sealing end surface.

Inventors:
TOYAMA TOMOICHIRO (JP)
Application Number:
PCT/JP2023/032956
Publication Date:
March 21, 2024
Filing Date:
September 11, 2023
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01S5/02234
Domestic Patent References:
WO2019240150A12019-12-19
Foreign References:
JP2022109722A2022-07-28
JP2022052552A2022-04-04
JP2022101471A2022-07-06
JP2005311364A2005-11-04
JP2021150577A2021-09-27
JP2022013030A2022-01-18
JP2019165127A2019-09-26
JP2013258434A2013-12-26
JP2013089791A2013-05-13
JP2010002522A2010-01-07
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
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