Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084865
Kind Code:
A1
Abstract:
A semiconductor device comprising: a first semiconductor element having, in one surface thereof, a pixel region in which a plurality of pixels have been disposed; a second semiconductor element mounted on said surface in an area outside the pixel region and having a first circuit electrically connected to the pixels; and a third semiconductor element mounted on the reverse side of the second semiconductor element from the first semiconductor element and having a second circuit electrically connected to the pixels.
Inventors:
NONAKA YASUHIRO (JP)
AKIYAMA KENTARO (JP)
ONO TOSHIAKI (JP)
AKIYAMA KENTARO (JP)
ONO TOSHIAKI (JP)
Application Number:
PCT/JP2023/033323
Publication Date:
April 25, 2024
Filing Date:
September 13, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Domestic Patent References:
| WO2010073520A1 | 2010-07-01 | |||
| WO2018198802A1 | 2018-11-01 | |||
| WO2018116864A1 | 2018-06-28 |
Foreign References:
| JP2005012221A | 2005-01-13 | |||
| JP2016163011A | 2016-09-05 | |||
| JP2014099582A | 2014-05-29 | |||
| JP2015135938A | 2015-07-27 | |||
| JP2002289908A | 2002-10-04 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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