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Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/079814
Kind Code:
A1
Abstract:
This semiconductor device 1 includes: a semiconductor chip 2 having a first main surface 3 in which an element region 6 is formed, and having surrounding end surfaces 5A-5D surrounding the first main surface 3; and a testing wiring 23 that is formed along the surrounding end surfaces 5A-5D on the first main surface 3 side of the semiconductor chip 2, and that surrounds the element region 6. The testing wiring 23 includes: a plurality of internal wiring parts 24 that are formed in the surface layer portion of the first main surface 3 of the semiconductor chip 2 and that are arranged along the surrounding end surfaces 5A-5D of the semiconductor chip 2 so as to be spaced apart from each other; and bridging wiring parts 25 that are formed above the first main surface 3 of the semiconductor chip 2, and that bridge between adjacent pairs of the internal wiring parts 24. The internal wiring parts 24 and the bridging wiring parts 25 are alternately arranged along the surrounding end surfaces 5A-5D.

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Inventors:
OKUDA HAJIME (JP)
JOITA ADRIAN (JP)
Application Number:
PCT/JP2022/031334
Publication Date:
May 11, 2023
Filing Date:
August 19, 2022
Export Citation:
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Assignee:
ROHM CO LTD (JP)
International Classes:
H01L29/78; H01L21/336; H01L21/822; H01L27/04
Foreign References:
JP2009239027A2009-10-15
JP2012253345A2012-12-20
JP2005277338A2005-10-06
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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