SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2022/080134

A1

This semiconductor device is provided with a first circuit, a second circuit, and an insulating element for relaying a signal transmitted between the first and second circuits. The first circuit includes a first die pad and a first semiconductor element mounted on the first die pad. The second circuit includes a second die pad and a second semiconductor element mounted on the second die pad. The insulating element is mounted on the first die pad, for example. The semiconductor device is further provided with a wire bonded to the insulating element and the second semiconductor element. The wire includes an upright portion, an incline portion, and an extension portion. The upright portion rises from the insulating element along a thickness direction of the first die pad. The incline portion extends from the second semiconductor element toward the insulating element at an incline relative to the thickness direction. The extension portion is disposed between the upright portion and the incline portion. The angle of inclination with respect to a plane orthogonal to the thickness direction is smaller for the extension portion than for the incline portion.

JPS6130255	[Title of the device] Lead frame
WO/2002/037562	LEAD FRAME AND SEMICONDUCTOR DEVICE USING THIS
JPH0611359	[Name of invention] Structure of lead terminal

MATSUBARA HIROAKI (JP)

PCT/JP2021/035772

April 21, 2022

September 29, 2021

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ROHM CO LTD (JP)

H01L23/50; H01L21/60; H01L25/07; H01L25/18

US20200168534A1	2020-05-28
JP2016207714A	2016-12-08
JPH11145179A	1999-05-28
JPH07176558A	1995-07-14
JP2004356382A	2004-12-16
US20120168901A1	2012-07-05

USUI Takashi et al. (JP)

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