Title:
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MOVING BODY
Document Type and Number:
WIPO Patent Application WO/2024/075283
Kind Code:
A1
Abstract:
A semiconductor device according to the present disclosure comprises: a base plate; a semiconductor chip that is provided to an area above the base plate; a case that is provided on the base plate, surrounds the semiconductor chip, has an outside surface and an inside surface on the reverse side from the outside surface, and has a recess formed in the outside surface; a nut that is press-fitted into the recess in the case and has a screw hole extending in the vertical direction formed therein; and a screw that is inserted into the nut from below the base plate.
Inventors:
DATE RYUTARO (JP)
Application Number:
PCT/JP2022/037643
Publication Date:
April 11, 2024
Filing Date:
October 07, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L25/07; H01L25/18
Foreign References:
| JP2010086977A | 2010-04-15 | |||
| JP2006032392A | 2006-02-02 | |||
| JP2011233814A | 2011-11-17 | |||
| JP2004214536A | 2004-07-29 |
Attorney, Agent or Firm:
TAKADA, TAKAHASHI & PARTNERS (JP)
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