Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084954
Kind Code:
A1
Abstract:
This semiconductor device comprises a semiconductor element, a support conductor that supports the semiconductor element, a support substrate that supports the support conductor, and a first intermediate bonding material that is interposed between the support conductor and the support substrate. The bond between the support conductor and the intermediate bonding material and the bond between the support substrate and the intermediate bonding material are both solid-phase bonds. One of the bonding interface between the support conductor and the intermediate bonding material and the bonding interface between the support substrate and the intermediate bonding material includes a bonding anomaly region in which the bonding condition is different from that of the surrounding area.
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Inventors:
YOSHIHARA KATSUHIKO (JP)
Application Number:
PCT/JP2023/036019
Publication Date:
April 25, 2024
Filing Date:
October 03, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/48; B23K20/00; H01L23/13; H01L25/07; H01L25/18
Foreign References:
| JP2014177031A | 2014-09-25 | |||
| JP2017165629A | 2017-09-21 | |||
| JP2012091975A | 2012-05-17 | |||
| JP2021031323A | 2021-03-01 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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