Title:
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND OPTICAL DETECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/080192
Kind Code:
A1
Abstract:
Provided are: a semiconductor device configured so that the degradation of the characteristics thereof is suppressed; a method for manufacturing a semiconductor device; and an optical detection device. The semiconductor device comprises: a first semiconductor layer having a first face and a second face located on the opposite side of the first face; a first interlayer insulation film provided on the first face side of the first semiconductor layer; a first opening provided in the first interlayer insulation film that opens on the surface of the first interlayer insulation film; an electrode provided in the first opening; and an insulation film that covers at least the lateral surfaces of the first opening and that is provided at a distance from the lateral surfaces of the electrode.
Inventors:
YAMAMOTO RYUSEI (JP)
HIDA SHOTA (JP)
TAZAKI MASAYUKI (JP)
HIDA SHOTA (JP)
TAZAKI MASAYUKI (JP)
Application Number:
PCT/JP2023/036116
Publication Date:
April 18, 2024
Filing Date:
October 03, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/522; H01L21/3205; H01L21/768; H01L23/532; H01L27/146; H04N25/70
Domestic Patent References:
WO2017126319A1 | 2017-07-27 | |||
WO2015050000A1 | 2015-04-09 |
Foreign References:
JP2011151375A | 2011-08-04 | |||
JP2006253355A | 2006-09-21 | |||
JP2008041804A | 2008-02-21 | |||
JP2011233746A | 2011-11-17 | |||
JPH05206303A | 1993-08-13 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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