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Patent Searching and Data


Title:
ROTARY ADJUSTING DEVICE FOR DICING HEAD, AND DICER
Document Type and Number:
WIPO Patent Application WO/2023/197516
Kind Code:
A1
Abstract:
The present application relates to the technical field of wafer cutting, and provides a rotary adjusting device for a dicing head, and a dicer. The rotary adjusting device for a dicing head comprises: a mounting seat; a transmission structure provided with a connecting shaft and a rotating shaft which are arranged at an angle, wherein one end of the connecting shaft is connected to a dicing blade, and the other end thereof is connected to the rotating shaft; and an adjusting structure provided with a driving member, wherein the driving member is suitable for abutting against the end of the rotating shaft away from the connecting shaft, and the driving member drives the rotating shaft to swing to drive the connecting shaft to rotate. According to the rotary adjusting device for a dicing head of the present invention, the driving member of the adjusting structure drives the rotating shaft to swing, and the rotating shaft drives the connecting shaft to rotate with the central axis of the rotating shaft as a center, thereby driving the cutter to rotate and implementing direct, convenient, and rapid adjustment of a cutting edge of the cutter with respect to a wafer position to be cut, without detaching and remounting the cutter.

Inventors:
WEN ZIXUN (CN)
ZHANG ZHIFENG (CN)
ZHANG YITUN (CN)
ZHANG WENJIE (CN)
MA XIUYUAN (CN)
LIU YAZHOU (CN)
Application Number:
PCT/CN2022/117446
Publication Date:
October 19, 2023
Filing Date:
September 07, 2022
Export Citation:
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Assignee:
HEBEI KTHAHCO TECH CO LTD (CN)
International Classes:
B28D5/00; B26D1/00; B28D7/00
Foreign References:
CN114505970A2022-05-17
JP2005193304A2005-07-21
CN113146865A2021-07-23
CN204773075U2015-11-18
CN209754034U2019-12-10
CN114227576A2022-03-25
Attorney, Agent or Firm:
SUNSHINE INTELLECTUAL PROPERTY INTERNATIONAL CO., LTD. (CN)
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