Title:
ROBOT HAND, SUBSTRATE CONVEYANCE DEVICE, HOLDING UNIT, AND SUBSTRATE REMOVAL METHOD
Document Type and Number:
WIPO Patent Application WO/2024/084538
Kind Code:
A1
Abstract:
The present invention provides a robot hand, a substrate conveyance device, a holding unit, and a substrate removal method that can be applied to substrates accommodated in a thin container with a narrow pitch and can accommodate warpage occurring in substrates. Provided are a robot hand, a substrate conveyance device comprising a substrate conveyance robot in which the robot hand is used, a holding unit for attachment to the robot hand, and a substrate removal method for removing a substrate using the robot hand. The robot hand comprises: a hand member for holding a substrate; a support section that is installed on the hand member and supports the lower surface of the substrate; and a first drive unit that is installed on the hand member and drives the support section. The first drive unit causes the support section to move between an advanced position above the upper surface of the hand member and a retracted position below the advanced position, and the advanced position is set to a position separate from the upper surface of the hand member by a distance greater than the maximum amount of warpage expected of the substrate.
Inventors:
MATSUMOTO BUNGO (JP)
HAMASAKI YUKI (JP)
HAMASAKI YUKI (JP)
Application Number:
PCT/JP2022/038518
Publication Date:
April 25, 2024
Filing Date:
October 17, 2022
Export Citation:
Assignee:
HIRATA SPINNING (JP)
International Classes:
H01L21/677
Foreign References:
| JP2022098006A | 2022-07-01 | |||
| JP2008047650A | 2008-02-28 | |||
| JP2015103534A | 2015-06-04 | |||
| JPH08335622A | 1996-12-17 | |||
| JPH1131732A | 1999-02-02 | |||
| JP2012099621A | 2012-05-24 | |||
| JPH08107136A | 1996-04-23 | |||
| JP2002170862A | 2002-06-14 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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