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Patent Searching and Data


Title:
RIGID POLYMER MOLDED BODY AND METHOD FOR PRODUCING RIGID POLYMER MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/048157
Kind Code:
A1
Abstract:
A method for producing a rigid polymer molded body according to the present invention comprises: a step in which a rigid polymer molded body is formed by depositing a rigid polymer on at least one of a first electrode and a second electrode from a rigid polymer dispersion that is obtained by dispersing the rigid polymer in a polar medium; and a step in which the rigid polymer molded body is dried. In the step in which a rigid polymer molded body is formed, a surface of the at least one electrode, on which the rigid polymer is to be deposited, has a projected part or a recessed part, which is larger than the thickness of the rigid polymer molded body.

Inventors:
NOGI MASAYA (JP)
KASUGA TAKAAKI (JP)
Application Number:
PCT/JP2022/035079
Publication Date:
March 30, 2023
Filing Date:
September 21, 2022
Export Citation:
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Assignee:
UNIV OSAKA (JP)
International Classes:
B05D3/10; B05D1/18; B05D7/14; B05D7/24; C08J3/075; C08J5/02; C08L1/00; C25D13/06; C25D13/12
Foreign References:
CN110904490A2020-03-24
KR20200121181A2020-10-23
JPH118153A1999-01-12
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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