Title:
RESONANT CIRCUIT ELEMENT AND CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2018/207447
Kind Code:
A1
Abstract:
In the present invention, a first conductive pattern is formed of a conductive material on a first surface, i.e., one surface of a flexible film formed of a dielectric material. An adhesive layer is provided on a second surface of the flexible film, said second surface being on the reverse side of the first surface. A pair of first external electrodes generate an electric field in the planar direction in a composite member comprising the flexible film and the adhesive layer, and cause a current to flow in the first conductive pattern.
Inventors:
IKEMOTO KIYOMI (JP)
Application Number:
PCT/JP2018/008765
Publication Date:
November 15, 2018
Filing Date:
March 07, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/01; H01F17/00; H01F27/00; H01G4/40; H03H7/09; H05K1/02; H05K1/03
Domestic Patent References:
| WO2011013662A1 | 2011-02-03 |
Foreign References:
| JPS58137206A | 1983-08-15 | |||
| JPS5853807A | 1983-03-30 | |||
| JP2008135430A | 2008-06-12 |
Attorney, Agent or Firm:
KITAYAMA, Mikio et al. (JP)
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