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Title:
RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/135924
Kind Code:
A1
Abstract:
Disclosed are a resistive random access memory and a manufacturing method. A memory area of the resistive random access memory comprises a first metal interconnection line, a resistive random access memory unit and a second metal interconnection line that are connected in sequence, wherein the whole or part of a bottom electrode of the resistive random access memory unit is arranged in a short through hole of a barrier layer on the first metal interconnection line; the first metal interconnection line is connected to the bottom electrode of the resistive random access memory unit; and the second metal interconnection line is connected to a top electrode of the resistive random access memory unit. By means of arranging the whole or part of the bottom electrode of the resistive random access memory unit in the short through hole of the barrier layer on the first metal interconnection line, the bottom electrode can be made to be very thin, such that the height of the resistive random access memory unit in a CMOS back end of line is reduced, the thickness, which needs to be occupied, of each layer in the CMOS back end of line is smaller, integration is facilitated, the back end of line of a logic circuit area cannot be influenced, and the total stacking thickness can meet the electrical property requirement of the resistive random access memory. The process integration scheme in the embodiments of the present application can make the integration of an RRAM and a standard CMOS simpler.

Inventors:
XIAO HAN (CN)
WANG ZONGWEI (CN)
HUANG RU (CN)
Application Number:
PCT/CN2020/136467
Publication Date:
July 08, 2021
Filing Date:
December 15, 2020
Export Citation:
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Assignee:
HANGZHOU WEIMING XINKE TECH CO LTD (CN)
ADVANCED INSTITUTE OF INFORMATION TECHNOLOGY AIIT PEKING UNIV (CN)
International Classes:
H01L45/00
Foreign References:
CN111081872A2020-04-28
CN111384081A2020-07-07
CN106611768A2017-05-03
CN105047682A2015-11-11
CN109411602A2019-03-01
US20140166961A12014-06-19
US20190371999A12019-12-05
Attorney, Agent or Firm:
BEIJING CHENQUAN INTELLECTUAL PROPERTY LAW FIRM (CN)
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