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Patent Searching and Data


Title:
RESISTIVE PASTE, CHIP RESISTOR AND GLASS PARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/022092
Kind Code:
A1
Abstract:
The present disclosure addresses the problem of enabling a resistor to achieve a good balance between high resistivity and low TCR. A resistive paste according to the present disclosure comprises metal particles, insulating particles, glass particles and a metal silicide. The metal particles contain copper and nickel. The insulating particles contain at least one substance that is selected from among alumina, zirconia, zinc oxide and boron nitride. A chip resistor (1) according to the present disclosure is provided with a resistor (13) and a substrate (11). The resistor (13) is formed on the substrate (11), while being formed of the above-described resistive paste.

Inventors:
AOIKE YUKI
ITO HIROKATSU
MATSUSHIMA KENICHI
NAKAYAMA SHOGO
FUJITA TOMOHIRO
OHBAYASHI TAKASHI
Application Number:
PCT/JP2022/030572
Publication Date:
February 23, 2023
Filing Date:
August 10, 2022
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01C7/00; H01B1/22
Foreign References:
JP2015046567A2015-03-12
JPS6454705A1989-03-02
JPH0496201A1992-03-27
JPH04298001A1992-10-21
JPS62209801A1987-09-16
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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