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Title:
RESIN PRODUCTION METHOD AND INSULATING STRUCTURE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/044358
Kind Code:
A1
Abstract:
This resin production method is for producing a resin with which an insulating structure formed at an outer periphery of a conductive body is impregnated, the method comprising: a filler-mixing step for mixing a nano-filler with an epoxy resin such that the proportion of the nano-filler is at least 15 wt% to produce a mixture; a shear-mixing step for shear-mixing the mixture; a diluent-mixing step for mixing, to the mixture after the shear-mixing step, a reactive diluent that reduces the viscosity of the epoxy resin; and a curing agent-mixing step for mixing an acid anhydride curing agent to the mixture after the diluent-mixing step.

Inventors:
USHIWATA KODAI (JP)
YAMASHITA YU (JP)
YOSHIMITSU TETSUO (JP)
IMAI TAKAHIRO (JP)
HIRAI HIROMITSU (JP)
Application Number:
PCT/JP2020/048025
Publication Date:
March 03, 2022
Filing Date:
December 22, 2020
Export Citation:
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Assignee:
TOSHIBA MITSUBISHI ELEC IND (JP)
International Classes:
C08J3/20; C08G59/42; H01B3/40; H01B17/56; H01B19/00; H01F5/00; H01F5/06; H01F27/32; H01F41/12; H02K3/30; H02K3/34
Domestic Patent References:
WO2017168880A12017-10-05
Foreign References:
JP2019131629A2019-08-08
JP2015083663A2015-04-30
JP2016072301A2016-05-09
JP2016128542A2016-07-14
JP2003238771A2003-08-27
JP2006249276A2006-09-21
JP2006057017A2006-03-02
JP2016511303A2016-04-14
US20130131218A12013-05-23
JP2006246599A2006-09-14
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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