Title:
RESIN MOLDED BODY AND METHOD FOR PRODUCING RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/070183
Kind Code:
A1
Abstract:
The present invention comprises a base material which includes a resin, a first coating film which is formed on a surface of the base material and the thickness of which is 100-1,000 micrometers, and a second coating film which is formed on a surface of the first coating film and the thickness of which is 100-1,000 micrometers.
Inventors:
KONDO MITSUHIRO (JP)
Application Number:
PCT/JP2023/027611
Publication Date:
April 04, 2024
Filing Date:
July 27, 2023
Export Citation:
Assignee:
INOUE MTP KK (JP)
International Classes:
B29C45/16; B32B27/00; B32B27/40
Foreign References:
| JP2013252685A | 2013-12-19 | |||
| JP2016518277A | 2016-06-23 |
Attorney, Agent or Firm:
KT&S IP FIRM, P.C. (JP)
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