Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/168970
Kind Code:
A1
Abstract:
Provided are a resin composition and molded article having excellent slidability, high tensile fracture nominal strain, and excellent heat aging resistance. This resin composition includes, with respect to 100 parts by mass of polyacetal resin (A), 0.1-50 parts by mass of an acid-modified olefin polymer (B) having an acid value of 1.0-30.0 mgKOH/g, and 0.01-5 parts by mass of a compound (C) containing two or more primary amino groups and/or secondary amino groups in total, said compound being selected from a dihydrazone compound, dihydrazide compound, urea compound, and melamine compounds. The ratio (B)/(C) of the acid-modified olefin polymer (B) to the amino group-containing compound (C) is 20-200.

Inventors:
ISHII TAKASHI (JP)
OHSHIMA MAKIKO (JP)
Application Number:
PCT/JP2022/004608
Publication Date:
August 11, 2022
Filing Date:
February 07, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
F16C33/20; C08K5/21; C08K5/24; C08K5/30; C08K5/3492; C08L23/26; C08L59/00
Domestic Patent References:
WO2016051881A12016-04-07
Foreign References:
JP2008214490A2008-09-18
JP2002053731A2002-02-19
JP2001164085A2001-06-19
JP2019006974A2019-01-17
JP2000265048A2000-09-26
Attorney, Agent or Firm:
SIKS & CO. (JP)
Download PDF: