Title:
RESIN COMPOSITION FOR DICING FILM SUBSTRATE, DICING FILM SUBSTRATE, AND DICING FILM
Document Type and Number:
WIPO Patent Application WO/2024/053490
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition for a dicing film substrate, the resin composition being capable of forming a dicing film substrate having excellent elongation at room temperature and at low temperatures and having excellent modulus strength at room temperature and at low temperatures. The above-mentioned problem is solved by a resin composition for a dicing film substrate, the resin composition comprising an ionomer (A) of an ethylene/unsaturated carboxylic acid copolymer, an ionomer (B) of an ethylene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer, and a styrene-based elastomer (C).
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Inventors:
NAKANO SHIGENORI
NISHIJIMA KOICHI
SAKUMA MASAMI
TAKAOKA HIROKI
NISHIJIMA KOICHI
SAKUMA MASAMI
TAKAOKA HIROKI
Application Number:
PCT/JP2023/031241
Publication Date:
March 14, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
DOW MITSUI POLYCHEMICALS COMPANY LTD (JP)
International Classes:
H01L21/301; B32B27/00; C08L23/26; C08L53/02
Foreign References:
| JP2015109436A | 2015-06-11 | |||
| JP2017098369A | 2017-06-01 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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