RESIN COMPOSITION, CURED PRODUCT, CAMERA MODULE, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2024/062904

A1

The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device.　That is, provided is a resin composition containing a polyfunctional epoxy resin, a monofunctional epoxy resin, and a latent curing agent. The polyfunctional epoxy resin contains a polyfunctional epoxy resin having an epoxy equivalent weight of 400 g/eq. or greater, and the resin composition satisfies the following conditions. Conditions: Given X as the content of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater / the epoxy equivalent weight of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater, Y as the content of the monofunctional epoxy resin / the epoxy equivalent weight of the monofunctional epoxy resin, and Z as the content of all polyfunctional epoxy resin / the epoxy equivalent weight of all polyfunctional epoxy resin, X/Z is 0.3 to 1.0 and Y/Z is 0.35 to 1.20.

JP3274265	EPOXY RESIN COMPOSITION
JPH10182942	LIQUID RESIN SEALANT
JPH062807	2 liquid type epoxy resin composite

WATANABE BUNYA (JP)

PCT/JP2023/031969

March 28, 2024

August 31, 2023

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NAMICS CORP (JP)

C08G59/20; C08K3/08; C08L63/00; C09J163/00; G02B1/16

WO2020175055A1	2020-09-03
WO2021033327A1	2021-02-25
WO2022064972A1	2022-03-31

JP2020023601A	2020-02-13
JPS5016864A	1975-02-21
JPH0959349A	1997-03-04
JP2005513226A	2005-05-12
JP2012197413A	2012-10-18
JP2016017122A	2016-02-01

ISSHIKI PATENT & TRADEMARK FIRM (JP)

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