Title:
RELIABILITY TEST APPARATUS AND RELIABILITY TEST METHOD
Document Type and Number:
WIPO Patent Application WO/2024/077695
Kind Code:
A1
Abstract:
A reliability test apparatus and a reliability test method, relating to the technical field of integrated circuits. The reliability test apparatus comprises: a test chip (210) and a test board (220), wherein at least part of chip metal pads (360) of the test chip (210) is connected to corresponding test board metal pads (380) of the test board (220) to form series links, and the series links are used for monitoring the connection reliability between the test board metal pads (380) and the at least part of the chip metal pads (360).
Inventors:
YANG HUIPENG (CN)
Application Number:
PCT/CN2022/130392
Publication Date:
April 18, 2024
Filing Date:
November 07, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G11C29/56
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
Download PDF: