Title:
RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2024/029346
Kind Code:
A1
Abstract:
A release film comprising a resin layer (A) on one surface of a base material film, and comprising a resin layer (B) on the other surface of the base material film, the resin layer (A) containing a silicone-resin-based release agent and having a thickness of 0.2-2.0 μm, and the resin layer (B) containing a non-silicone-resin-based release agent. The present invention makes it possible to provide a release film and a release laminate in which the peel characteristics of release layers does not readily change due to blocking even while ultra-easy peeling is realized with respect to various adhesive agents.
Inventors:
YOSHIDA AOI (JP)
TOJO YOSHIAKI (JP)
HAYASHIZAKI KEIICHI (JP)
OSEKI YOUSUKE (JP)
SUZUKI TARO (JP)
TOJO YOSHIAKI (JP)
HAYASHIZAKI KEIICHI (JP)
OSEKI YOUSUKE (JP)
SUZUKI TARO (JP)
Application Number:
PCT/JP2023/026510
Publication Date:
February 08, 2024
Filing Date:
July 20, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/00; C09J7/38; C09J7/40
Domestic Patent References:
| WO2016158037A1 | 2016-10-06 |
Foreign References:
| JP2003080638A | 2003-03-19 | |||
| JP2018130877A | 2018-08-23 | |||
| JP2011173362A | 2011-09-08 | |||
| JP2001003010A | 2001-01-09 | |||
| JP2020108937A | 2020-07-16 | |||
| JP2022112759A | 2022-08-03 | |||
| JP2018161824A | 2018-10-18 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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