Title:
RELEASE FILM FOR MOLDING RESIN SHEETS
Document Type and Number:
WIPO Patent Application WO/2023/276892
Kind Code:
A1
Abstract:
In the present invention, the release properties of a release film are enhanced, and a release film that undergoes little charging upon unrolling is produced, whereby there is provided a release film for molding resin sheets for which there is no risk of defects occurring during the manufacture of a resin sheet. This release film for molding resin sheets has a base material film, and a release layer provided on one surface of the base material film, wherein: the release film has a hydrophobized layer on the surface of the base material film on the side opposite from the release layer; the release layer is formed from a cured article of a composition having a cation-curable polydimethylsiloxane (a); the water contact angle of the hydrophobized layer is 90-130°, inclusive; and the normal release force (I) and the post-heating release force (II), as measured in a release film obtained by temporarily rolling the aforementioned release film into a roll and then unrolling the release film, satisfy the expression (II)/(I) = 1.00-1.50, inclusive.
Inventors:
SHIGENO KENTO (JP)
SHIBATA YUSUKE (JP)
MORI KENICHI (JP)
YAMAGUCHI KEITA (JP)
SHIBATA YUSUKE (JP)
MORI KENICHI (JP)
YAMAGUCHI KEITA (JP)
Application Number:
PCT/JP2022/025370
Publication Date:
January 05, 2023
Filing Date:
June 24, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B28B1/30
Domestic Patent References:
| WO2019131449A1 | 2019-07-04 |
Foreign References:
| JP2013073700A | 2013-04-22 | |||
| JP2020128055A | 2020-08-27 | |||
| JP2017002254A | 2017-01-05 | |||
| JP2019072848A | 2019-05-16 | |||
| JP2021070711A | 2021-05-06 |
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