CHAMBER

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to refrigeration systems, particularly for cooling a vacuum chamber and/or for capturing condensable substances, e.g. water vapor. In particular, embodiments of the present disclosure relate to closed-loop refrigeration systems for cooling a vacuum chamber and/or for capturing condensable substances, particularly a vacuum processing chamber, of a substrate processing system. Further embodiments of the present disclosure relate to vacuum chambers, substrate processing systems and methods of cooling a vacuum chamber and/or for capturing condensable substances.

BACKGROUND

[0002] In many applications, it is necessary to deposit thin layers on a substrate. The substrates can be coated in one or more chambers of a coating apparatus. The substrates may be coated in a vacuum, using a vapor deposition technique.

[0003] Several methods are known for depositing a material on a substrate. For instance, substrates may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process etc. The process is performed in a process apparatus or process chamber where the substrate to be coated is located. A deposition material is provided in the apparatus. A plurality of materials, and also oxides, nitrides or carbides thereof, may be used for deposition on a substrate. Coated materials may be used in several applications and in several technical fields. For instance, substrates for displays are often coated by a physical vapor deposition (P VD) process. Further applications include insulating panels, organic fight emitting diode (OLED) panels, substrates with thin film transistors (TFT), color filters or the like.

[0004] For a PVD process, the deposition material can be present in the solid phase as a target. By bombarding the target with energetic particles, atoms of the target material, i.e. the material to be deposited, are ejected from the target. The atoms of the target material are deposited on the substrate to be coated.

[0005] Typically, material deposition in vacuum process chambers, particularly using PVD, is carried out at elevated temperatures. Accordingly, there is a demand for providing cooling systems for vacuum process chambers, particularly for capturing water vapor and/or other condensable substances, especially for processing temperature sensitive substrates.

SUMMARY

[0006] In fight of the above, a refrigeration system, particularly a closed- loop refrigeration system for cooling a vacuum chamber of a substrate processing system and/or for capturing water vapor and/or other condensable substances, a vacuum chamber, a substrate processing system, a method of cooling a vacuum chamber, and a rotary union for a refrigeration system according to the independent claims are provided. Further aspects, advantages, and features are apparent from the dependent claims, the description, and the accompanying drawings.

[0007] According to an aspect of the present disclosure, a refrigeration system is provided. The refrigeration system includes a heat absorber. The heat absorber includes a coolant piping. The coolant piping includes a coolant input and a coolant output. The coolant input is connected to a first passage of a rotary union. The coolant output is connected to a second passage of the rotary union.

[0008] According to a further aspect of the present disclosure, a closed-loop refrigeration system for cooling a vacuum chamber of a substrate processing system is provided. In particular, the closed-loop refrigeration system is configured for capturing water vapor and/or other condensable substances by freezing the water vapor and or the other condensable substances onto cold surfaces cooled by the refrigeration system. The closed-loop refrigeration system includes a heat absorber, a pressure decreaser, a pressure increaser, and a heat rejector. In particular, the heat absorber is an evaporator, the pressure decreaser is a metering device or an expansion valve, the pressure increaser is a compressor, and the heat rejector is a condenser. Further, the closed-loop refrigeration system includes a rotary union connecting a coolant piping of the heat absorber to the pressure decreaser and the pressure increaser.

[0009] According to another aspect of the present disclosure, a vacuum chamber for a substrate processing system is provided. The vacuum chamber includes a heat absorber of a refrigeration system according to any embodiments described herein.

[0010] According to a further aspect of the present disclosure, a substrate processing system is provided. The substrate processing system includes a vacuum chamber, a deposition source provided in the vacuum chamber, and a refrigeration system according to any embodiments described herein.

[0011] According to a further aspect of the present disclosure, a rotary union for a refrigeration system is provided. The rotary union includes a main body having a first passage and a second passage. Additionally, the rotary rmion includes a bushing circumferentially surrounding the main body. Further, the rotary union includes a first coolant connector and a second coolant connector. The first coolant connector is connected to the bushing. The second coolant connector is connected to the main body, particularly via a mounting plate. Further, the rotary union includes sealings provided at the interface between the first coolant connector and the bushing, at the interface between the bushing and the main body, and at the interface between the second coolant connector and the main body, particularly at the interface between the main body and the mounting plate and at the interface between the second coolant connector and the mounting plate. At least one of the main body, the bushing, the sealings and the mounting plate include a high and low temperature resistant polymeric material, particularly the polymeric material being resistant in a temperature range from -160°C to + 150°C.

[0012] According to another aspect of the present disclosure, a method of cooling a vacuum chamber of a substrate processing system is provided, particularly for capturing water vapor and/or other condensable substances. The method includes using a refrigeration system according to any embodiments described herein.

[0013] According to yet another aspect of the present disclosure, a method of manufacturing a coated substrate is provided. The method includes using at least one of a refrigeration system according to any embodiments described herein, a vacuum chamber according to any embodiments described herein, and a substrate processing system according to any embodiments described herein.

[0014] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the disclosure and are described in the following:

FIG. 1 shows a schematic view of a refrigeration system according to embodiments described herein;

FIG. 2 shows a schematic view of a refrigeration system according to further embodiments described herein;

FIG. 3 shows a schematic view of a vacuum chamber provided with a refrigeration system according to embodiments described herein;

FIG. 4 shows a schematic view of a rotary union for a refrigeration system according to embodiments described herein;

FIG. 5 shows a schematic view of a substrate processing system according to embodiments described herein;

FIG. 6 shows a block diagram for illustrating a method of cooling a vacuum chamber of a substrate processing system according to embodiments described herein; and

FIG. 7 shows a block diagram for illustrating a method of manufacturing a coated substrate according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS

[0016] Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures.

Within the following description of the drawings, same reference numbers refer to same components. Only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant as a limitation of the disclosure. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0017] With exemplary reference to FIG. 1, a refrigeration system 100 according to the present disclosure is described. According to embodiments which can be combined with any other embodiments described herein, the refrigeration system 100 includes a heat absorber 110. The heat absorber 110 has coolant piping 113 with a coolant input 111 and a coolant output 112. As exemplarily shown in FIG. 1, the coolant input is connected to a first passage 141 of a rotary union 140 and the coolant output 112 is connected to a second passage 142 of the rotary union 140. Typically, the first passage 141 is connected to a coolant input line 114 and the second passage 142 is connected to a coolant output line 115. The coolant input fine 114 provides coolant to the coolant piping 113. The coolant output fine 115 removes the coolant from the coolant piping 113. In other words, the coolant input line 114 is configured for supplying coolant to the coolant piping 113 of the heat absorber 110. Accordingly, the coolant output line 115 is configured for discharging coolant from the coolant piping 113 of the heat absorber 110.

[0018] Accordingly, a refrigeration system is provided which beneficially provides for the possibility to provide the heat absorber of the refrigeration system in a pivotable door of a vacuum chamber. As result thereof, a closed- loop refrigeration system for cooling a vacuum chamber of a substrate processing system refrigeration system with a more compact design compared to the state of the art can be provided such that beneficially space limitation issues can be solved. Further, it is to be understood that embodiments of the refrigeration system as described herein beneficially provide for capturing water vapor and/or other condensable substances, e.g. by freezing the water vapor and or the other condensable substances onto cold surfaces cooled by the refrigeration system.

[0019] With exemplary reference to FIGS. 2 and 3, further aspects and features of the refrigeration system 100 according to embodiments of the present disclosure are described. According to embodiments which can be combined with any other embodiments described herein, the first passage 141 of the rotary union 140 is connected to a pressure decreaser 120. In particular, the first passage 141 of the rotary union 140 can be connected to the pressure decreaser 120 via a coolant input line 114, as exemplarily shown in FIG. 2. For instance, the pressure decreaser 120 can be a metering device or an expansion valve. Typically, the second passage 142 of the rotary union 140 is connected to a pressure increaser 130. In particular, the second passage 142 of the rotary union 140 can be connected to the pressure increaser 130 via a coolant output line 115, as exemplarily shown in FIG. 2. For instance, the pressure increaser 130 can be a compressor.

[0020] According to embodiments which can be combined with any other embodiments described herein, the first passage 141 of the rotary union 140 has a first input opening 141A, as exemplarily indicated in FIG. 2. Further, the first passage 141 of the rotary union 140 has a first output opening 141B. Typically, the first input opening 141A is connected to the coolant input line 114. The first output opening 141B is connected to the coolant input 111 of the coolant piping 113. As exemplarily indicated in FIG. 2, typically the second passage 142 has a second input opening 142A and a second output opening 142B. The second input opening 142A is connected to the coolant output 112 of the coolant piping 113. The second output opening 142B is connected to the coolant output line 115.

[0021] As exemplarily shown in FIG. 2, typically the refrigeration system according to embodiments described herein is a closed-loop refrigeration system. According to embodiments which can be combined with any other embodiments described herein, the closed-loop refrigeration system includes a heat absorber 110, a pressure decreaser 120, a pressure increaser 130, a heat rejector 150, and a rotary union 140 connecting the heat absorber 110, particularly the coolant piping 113 of the heat absorber 110, to the pressure decreaser 120 and the pressure increaser 130. The heat absorber 110 can be an evaporator. The pressure decreaser 120 can be a metering device or an expansion valve. The pressure increaser 130 can be a compressor. The heat rejector 150 can be a condenser.

[0022] As exemplarily shown in FIG. 2, the second output opening 142B of the second passage 142 of the rotary union 140 is connected via the coolant output line 115 to a pressure increaser input 131. The coolant output line 115 may also be referred to as a suction line. The pressure increaser input 132 is connected via a first connection line 116 to a heat rejector input 151 of the heat rejector 150. The first connection line 116 may also be referred to as a hot gas line. The heat rejector output 152 of the heat rejector 150 is connected via a second connection line 117 to the pressure decreaser input 121 of the pressure decreaser 120. The second connection line 117 may also be referred to as a liquid line. The pressure decreaser output 122 of the pressure decreaser 120 is connected via the coolant input line 114 to the first input opening 141A of the first passage 141 of the rotary union 140. The coolant input line 114 may also be referred to as a coolant supply line. The first output opening 141B of the first passage 141 of the rotary union 140 is connected to the coolant input 111 of the coolant piping 113 of the heat absorber 110. The coolant output 112 of the coolant piping 113 is connected to the second input opening 142A of the second passage 142 of the rotary union 140. For better understanding, the flow direction of the coolant in the refrigeration system is exemplarily indicated by arrow F in FIG. 2.

[0023] With exemplary reference to FIG. 3, according to embodiments which can be combined with any other embodiments described herein, the heat absorber 110 is provided in a pivotable door 220, particularly of a vacuum chamber 210 for a processing system. The rotary union 140 is connected to the pivotable door 220. Further, the rotary union 140 can be installed inside the vacuum chamber 210 (not explicitly shown) or outside of the vacuum chamber 210, as schematically shown in FIG. 3.

[0024] Accordingly, with exemplary reference to FIG. 3, it is to be understood that according to a further aspect of the present disclosure, a vacuum chamber 210 for a substrate processing system is provided, the vacuum chamber 210 being coupled to a refrigeration system 100 according to any embodiments described herein. In particular, the vacuum chamber 210 can be coupled to a refrigeration system 100 by providing the vacuum chamber 210 with a heat absorber 110 of a refrigeration system 100 according any embodiments described herein. In particular, the heat absorber 110 may be provided in a pivotable door 220 of the vacuum chamber 210.

[0025] According to embodiments which can be combined with any other embodiments described herein, the vacuum chamber is a vacuum process chamber for vertical substrate processing. In particular, the vacuum chamber is configured for vertical processing of large area substrates. In the present disclosure, a “vacuum chamber” can be understood as a chamber configured to provide a vacuum within the chamber. Typically, the flexible substrate is transported through a vacuum chamber as described herein. The term “vacuum”, as used herein, can be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10" ⁵ mbar and about 1 O' ⁸ mbar, more typically between 10' ⁵ mbar and IO" ⁷ mbar, and even more typically between about 10" ⁶ mbar and about IO" ⁷ mbar.

[0026] The term “substrate” as used herein shall particularly embrace inflexible substrates, e.g., glass plates. The present disclosure is not limited thereto, and the term “substrate” may also embrace flexible substrates such as a web or a foil. Further, also a sensitive substrate may be included.

[0027] According to some examples, a large area substrate can be GEN 4.5, which corresponds to about 0.67 m ² substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m ² substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m ² substrates (1.95 m x 2.2 m), GEN 8, which corresponds to about 5.3m ² substrates (2.16 m x 2.46 m), or even GEN 10, which corresponds to about 9.0 m ² substrates (2.88 m x 3.13 m). Even larger generations such as GEN 11 , GEN 12 and/or corresponding substrate areas can similarly be implemented. Accordingly, a large area substrate can be understood as a substrate having a surface to be processed of at least 0.5 m ² , particularly at least 1.0 m ² , more particularly at least 3.0 m ² , or even 5.0 m ² or more.

[0028] In the present disclosure, “vertical substrate processing” can be understood in that, during processing, the substrate is substantially vertically oriented. The vertical direction corresponds to the direction of the force of gravity. A substantially vertical oriented substrate can be understood as a substrate being oriented with a tolerance T of T < ±15°, particularly T< ±10°, more particularly T< ±5°, for instance T< ±1° with respect to the vertical direction, i.e. the direction of the force of gravity.

[0029] With exemplary reference to FIG. 4, a rotary union 140 for a refrigeration system according to the present disclosure is described. According to embodiments which can be combined with any other embodiments described herein, rotary union 140 includes a main body 143 comprising a first passage 141 and a second passage 142. Additionally, the rotary union 140 includes a bushing 144 circumferentially surrounding the main body 143. Further, the rotary union 140 includes a first coolant connector 146 and a second coolant connector 147. The first coolant connector 146 is connected to the bushing 144. The second coolant connector 147 connected to the main body 143, particularly via a mounting plate 148. Typically, the mounting plate 148 is configured for mounting the rotary union 140 to a pivotable door or to a vacuum chamber wall. Further, the rotary union 140 includes sealings 145 provided at the interface between the first coolant connector 146 and the bushing 144, at the interface between the bushing 144 and the main body 143, and at the interface between the second coolant connector 147 and the main body 143, particularly at the interface between the main body 143 and the mounting plate 148 and at the interface between the second coolant connector 147 and the mounting plate 148. At least one of the main body 143, the bushing 144, the sealings 145 and the mounting plate 148 include a high and low temperature resistant polymeric material. In particular, a main portion (i.e. more than 50%) of at least one of the main body 143, the bushing 144, the sealings 145 and the mounting plate 148 may be made of a high and low temperature resistant polymeric material. Typically, the temperature resistant polymeric material is temperature resistant in a temperature range from -160°C to + 150°C.

[0030] Accordingly, a rotary union according to embodiments described herein beneficially provides for the possibility to provide a heat absorber of a refrigeration system, particularly a cryogenic refrigeration system, in a pivotable door of a vacuum chamber. Further, using a rotary union 140 according to embodiments described has the advantage that, compared to the state of the art, a refrigeration system with a more compact design can be provided such that beneficially space limitation issues can be solved. Moreover, the rotary union according to embodiments described herein beneficially provides for an improved performance compared to the state of the art, particularly in the temperature range from -160°C to + 150°C. Further, the rotary union according to embodiments described herein is particularly well suited for high pressures (e.g. up to 45 bar) as well as for low pressures (e.g. vacuum pressures). [0031] According to embodiments which can be combined with any other embodiments described herein, at least one of the main body 143, the bushing 144, the sealings 145 and the mounting plate 148 may be made of a material including 50% or more, particularly 70% or more, more particularly 90% or more, or even consist of a high and low temperature resistant polymeric material as described herein.

[0032] For instance, the high and low temperature resistant polymeric material can be selected from the group consisting of polyimide (PI), polyether ether ketone (PEEK), high performance polyamide (HPPA), polyamidimid (PAI), and polytetrafluoroethylene (PTFE).

[0033] According to embodiments which can be combined with any other embodiments described herein, the first coolant connector 146 includes a first connector piping 146A and a second connector piping 146B. As exemplarily shown in FIG. 4, the first connector piping 146A is in fluid communication with the first passage 141 and the second connector piping 146B is in fluid communication with the second passage 142. Typically, the first connector piping 146 A can be connected to the coolant input line 114 as described herein. The second connector piping 146B can be connected to the coolant output line 115 as described herein. For example, the first coolant connector 146 can be made of stainless steel. Alternatively, the first coolant connector 146 can be made of a high and low temperature resistant polymeric material as described herein.

[0034] According to embodiments which can be combined with any other embodiments described herein, the second coolant connector 147 includes a third connector piping 147A and a fourth connector piping 147B. As exemplarily shown in FIG. 4, the third connector piping 147 A is in fluid communication with the first passage 141 and the fourth connector piping 147B is in fluid communication with the second passage 142. Typically, the third connector piping 147 A can be connected to the coolant input 111 of the coolant piping 113 of the heat absorber 110 as described herein. The fourth connector piping 147B can be connected to the coolant output 112 of the coolant piping 113 of the heat absorber 110 as described herein. For example, the second coolant connector 147 can be made of stainless steel. Alternatively, the second coolant connector 147 can be made of a high and low temperature resistant polymeric material as described herein.

[0035] As exemplarily shown in FIG. 4, according to embodiments which can be combined with any other embodiments described herein, the rotary union 140 includes a bushing casing 161 and/or a main body casing 162. In particular, the rotary union 140 can include at least one of a bushing casing 161 encasing the bushing 144 and a main body casing 162 at least partially encasing the main body 143. In particular, the bushing casing 161 is configured for providing a first intermediate space 161 A between an inner surface of the bushing casing 161 and an outer surface of the bushing 144. For instance, the first intermediate space 161A can be provided by providing a recess at the inner surface of the bushing casing 161. Similarly, the main body casing 162 can be configured for providing a second intermediate space 162A between an inner surface of the main body casing 162 and an outer surface of the main body 143. For instance, the second intermediate space 162A can be provided by providing a recess at the inner surface of main body casing 162. It is to be understood that typically the first intermediate space 161A and the second intermediate space 162A are void spaces which can be filled with air.

[0036] Providing a bushing casing 161 and/or a main body casing 162 as described herein can be beneficial for improving the performance of the rotary union 140 compared to the state of the art, particularly when employed in a temperature range from -160°C to + 150°C and/or a pressure range from about 10' ⁷ mbar up to 45 bar. [0037] According to embodiments which can be combined with any other embodiments described herein, at least one of the bushing casing 161 and the main body casing 162 include a high and low temperature resistant polymeric material selected from the group consisting of polyimide (PI), polyether ether ketone (PEEK), high performance polyamide (HPPA), polyamidimid (PAI), and polytetrafluoroethylene (PTFE). In particular, the bushing casing 161 and/or the main body casing 162 can be made of a material including 50% or more, particularly 70% or more, more particularly 90% or more, or even consist of a high and low temperature resistant polymeric material as described herein.

[0038] With exemplary reference to FIG. 4, according to embodiments which can be combined with any other embodiments described herein, the bushing 144 includes a first bushing opening 144A and a second bushing opening 144B. The first bushing opening 144A is aligned with the first input opening 141 A of the first passage 141. The second bushing opening 144B is aligned with the second output opening 142B of the second passage 142.

[0039] As exemplarily shown in FIG. 4, the bushing 144 can include a first bushing 144A and a second bushing 144B, i.e. two separate bushings. The first bushing opening 144A can be provided in the first bushing 144C. The second bushing opening 144B can be provided in the second bushing 144D.

[0040] With exemplary reference to FIG. 5, a substrate processing system 200 according to the present disclosure is described. According to embodiments which can be combined with other embodiments described herein, the substrate processing system 200 includes a vacuum chamber 210, a deposition source 230 provided in the vacuum chamber 210, and a refrigeration system 100 according to any embodiments described herein. Typically, the vacuum chamber 210 and the deposition source 230 are configured for vertical large area substrate processing. As schematically shown in FIG. 5, employing a refrigeration system 100 according to any embodiments described herein has the advantage that the pressure decreaser 120, the heat rejector 150, and the pressure increaser 130 can be arranged below the vacuum chamber 210. In other words, the pressure decreaser 120, the heat rejector 150, and the pressure increaser 130, which altogether may also be referred to as poly-cold, can be provided on a first level and the vacuum chamber 210 can be provided on a second level above the first level.

[0041] Accordingly, by providing a substrate processing system 200 with a refrigeration system 100 as described herein, an improved substrate processing system 200 can be provided compared to the state of the art.

[0042] According to an example, the deposition source 230 can be a sputter source, particularly for depositing material on large area substrates. In other words, typically the deposition source 230 as described herein is configured for coating large area substrates using sputtering, particularly PVD sputtering.

[0043] For instance, sputtering can be undertaken as diode sputtering or as magnetron sputtering. Magnetron sputtering is particularly advantageous in that the deposition rates are rather high. By arranging the magnet assembly or magnetron behind the sputter material of the cathode or sputter target, in order to trap the free electrons within the magnetic field which is generated in the direct vicinity of the target surface, these electrons are forced to move within the magnetic field and cannot escape. This enhances the probability of ionizing the gas molecules typically by several orders of magnitude. This, in turn, increases the deposition rate substantially. For example, in the event of a rotatable sputter target, which may have an essentially cylindrical form, the magnet assembly can be positioned inside the rotatable cathode or sputter target.

[0044] With exemplary reference to the block diagram shown in FIG. 6, a method 300 of cooling a vacuum chamber 210 of a substrate processing system 200 according to the present disclosure is described. The method 300 includes using (represented by block 310 in Fig. 6) a refrigeration system 100 according to any embodiments described herein. It is to be understood that the method 300 of cooling can be employed for capturing water vapor and/or other condensable substances by freezing the water vapor and or the other condensable substances onto cold surfaces cooled by the refrigeration system.

[0045] Accordingly, by using a refrigeration system 100 as described herein, an improved method of cooling a vacuum chamber of a substrate processing system can be provided compared to the state of the art. F urther, an improved method of capturing water vapor and/or other condensable substances is provided.

[0046] With exemplary reference to the block diagram shown in FIG. 7, a method 400 of manufacturing a coated substrate according to the present disclosure is described. The method 400 includes using (represented by block 410 in Fig. 7) at least one of a refrigeration system 100 according to any embodiments described herein, a vacuum chamber 210 according to any embodiments described herein, a substrate processing system 200 according to any embodiments described herein, and a rotary union 140 according to any embodiments described herein.

[0047] According to embodiments which can be combined with any other embodiments described herein, the method 400 includes coating (represented by block 420 in FIG. 7) a substrate, particularly a large area substrate, by using a deposition source 230 as described herein. As an example, coating (represented by block 420 in FIG. 7) may include sputtering of conductive or semi-conductive materials. For example, coating may include sputtering a transparent conductive oxide film onto a substrate as described herein. According to other examples, coating may include sputtering of materials like ITO, IZO, IGZO or MoN. Further, coating may include sputtering of silver (Ag), Ag alloys and/or magnesium (Mg). Further exemplarily, coating may include sputtering of metallic material. Thus, sputtering may be utilized for the deposition of electrodes, particularly transparent electrodes in displays, particularly OLED displays, liquid crystal displays, and touchscreens. Further, sputtering may be utilized for the deposition of electrodes, particularly transparent electrodes in thin film solar cells, photodiodes, and smart or switchable glass.

[0048] It is to be understood that for coating the substrate, the substrate can be continuously moved during coating past the deposition source (“dynamic coating”). Alternatively, the substrate may rest essentially at a constant position during coating (“static coating”). Further, also substrate sweeping or substrate wobbling may be possible. The embodiments described in the present disclosure relate to both dynamic coating and static coating processes.

[0049] In view of the above, it is to be understood that compared to the state of the art, embodiments of the present disclosure beneficially provide an improved refrigeration system, particularly an improved closed-loop refrigeration system for cooling a vacuum chamber of a substrate processing system and/or capturing condensable substances (e.g. water vapor), an improved vacuum chamber for a substrate processing system, an improved substrate processing system, an improved rotary union for a refrigeration system and an improved method of cooling a vacuum chamber and/or capturing condensable substances (e.g. water vapor). Further, it is to be understood that compared to the state of the art, beneficially a dynamic closed loop refrigeration system is provided since the usage of the rotary union as described herein has the advantage that the heat absorber can be movable, e.g. provided in a pivotable door.

[0050] While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope, and the scope is determined by the claims that follow.