Title:
RADIO WAVE ABSORBER FOR HIGH-FREQUENCY COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/127404
Kind Code:
A1
Abstract:
Provided is a radio wave absorber for a high-frequency communication device with which it is possible to improve productivity, reduce cost, and further achieve weight reduction. For example, a radio wave absorber (10) comprises: a side portion (40) that is disposed around a semiconductor element (110) fixed to a base portion (20) provided in a high-frequency communication device (100); and a top portion (50) that closes an open face surrounded by the side portion (40). A plurality of projections (60) are provided on the inner surface of the top portion (50). The projections (60) protrude toward the semiconductor element (110) positioned inside the radio wave absorber (10), are spaced apart from the semiconductor element (110), and are periodically disposed. The projections (60) are formed so as to taper toward the semiconductor element (110), and are integrally molded with synthetic resin.
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Inventors:
MURANAKA MAKOTO (JP)
FUJIU TATSURO (JP)
FUJIU TATSURO (JP)
Application Number:
PCT/JP2022/044615
Publication Date:
July 06, 2023
Filing Date:
December 02, 2022
Export Citation:
Assignee:
NIFCO INC (JP)
International Classes:
H05K9/00; H01Q17/00
Foreign References:
| JP2021536126A | 2021-12-23 | |||
| JP2019190928A | 2019-10-31 | |||
| JP2004022685A | 2004-01-22 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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