Title:
PROCESS FOR PRODUCING SOLDER POWDER
Document Type and Number:
WIPO Patent Application WO/2011/062222
Kind Code:
A1
Abstract:
A process for producing a solder powder is provided by which it is possible to efficiently obtain a solder powder having an average particle diameter of 0.05 µm or larger but less than 3 µm in a stable yield.
The process for producing a solder powder comprises: a step in which a solid or liquid metal, a nonaqueous solvent, and balls for pulverization that have a diameter of 0.05-5 mm are introduced into a vessel to obtain a mixture; a step in which the mixture is heated to a temperature between (melting point of the metal)-5ºC and (melting point of the metal)+20ºC and stirred; a step in which the balls for pulverization are separated from the stirred mixture to obtain a mixture of a solder powder and the nonaqueous solvent; and a step in which the mixture of a solder powder and the nonaqueous solvent is subjected to solid-liquid separation to obtain the solder powder.
Inventors:
ISHIKAWA YUICHI (JP)
Application Number:
PCT/JP2010/070563
Publication Date:
May 26, 2011
Filing Date:
November 18, 2010
Export Citation:
Assignee:
DOWA HOLDINGS CO LTD (JP)
ISHIKAWA YUICHI (JP)
ISHIKAWA YUICHI (JP)
International Classes:
B22F9/06; B22F1/00; B22F9/04; B23K35/40; B23K35/26; C22C13/00
Domestic Patent References:
| WO2009011981A2 | 2009-01-22 |
Foreign References:
| JPS64204A | 1989-01-05 | |||
| JPH0533017A | 1993-02-09 |
Attorney, Agent or Firm:
HAGIWARA, Yasushi et al. (JP)
Yasushi Hagiwara (JP)
Yasushi Hagiwara (JP)
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