PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE

Title:

PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2024/063127

Kind Code:

A1

Abstract:

A pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer that catches elements separated from a holding substrate, wherein the pressure-sensitive adhesive layer has recesses and protrusions in the surface thereof and has a complex shear modulus at 23°C of 0.001-1.0 MPa.

Inventors:

KATO TOMOFUMI (JP)
NISHIJIMA KENTA (JP)
SUEYOSHI HARUKI (JP)
ONISHI GO (JP)
SUGINO TAKASHI (JP)
MASUMOTO MUTSUMI (JP)

Application Number:

PCT/JP2023/034248

Publication Date:

March 28, 2024

Filing Date:

September 21, 2023

Export Citation:

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Assignee:

LINTEC CORP (JP)

International Classes:

B32B27/00; B32B3/30; B32B7/06; B32B27/30; C09J4/02; C09J5/00; C09J7/24; C09J7/38; C09J133/00; C09J201/00; H01L21/301; H01L21/56; H01L21/683

Domestic Patent References:

WO2019216262A1

2019-11-14

Foreign References:

JP2020061529A	2020-04-16
JP2022014690A	2022-01-20
JP2009152387A	2009-07-09
JP2021123604A	2021-08-30
JP2021118274A	2021-08-10