Title:
PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/075245
Kind Code:
A1
Abstract:
The present invention relates to a prepreg containing a thermosetting resin composition and a fiber base material, the prepreg having one surface, and another surface on the opposite side from the one surface. The prepreg comprises, starting from at least either of the one surface and the another surface as a starting point, toward the surface on the opposite side from the surface serving as the starting point, in the stated order: a first region that constitutes the surface of the prepreg serving as the starting point and that contains a thermosetting resin composition; and a second region that contains a thermosetting resin composition that differs from the thermosetting resin composition contained in the first region. The storage modulus E'(1) at 260°C of a cured product of the thermosetting resin composition contained in the first region is lower than the storage modulus E'(2) at 260°C of a cured product of the thermosetting resin composition contained in the second region.
Inventors:
KOBAYASHI YUZURU (JP)
KOTAKE TOMOHIKO (JP)
KOTAKE TOMOHIKO (JP)
Application Number:
PCT/JP2022/037428
Publication Date:
April 11, 2024
Filing Date:
October 06, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08J5/24; B32B15/08; C08K3/00
Domestic Patent References:
| WO2018124169A1 | 2018-07-05 |
Foreign References:
| JP2009275086A | 2009-11-26 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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