Title:
PREPARATION METHOD FOR SEMICONDUCTOR INTERCONNECT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/082644
Kind Code:
A1
Abstract:
Provided in the present invention is a preparation method for a semiconductor interconnect structure. A first metal interconnect layer for electrical connection is formed on the surface of a first semiconductor substrate, and a second metal interconnect layer for electrical connection is formed on the surface of a second semiconductor substrate; and bonding parts are formed at the edge of the surface of at least one of the first metal interconnect layer and the second metal interconnect layer, such that connection spaces located between first metal parts and second metal parts are provided on the basis of the bonding parts. After a bonding process is carried out, chemical plating is used to form metal interconnect parts so as to connect the first metal parts, which are in the first metal interconnect layer, to the second metal parts, which are in the second metal interconnect layer, thereby achieving good electrical interconnect between the first metal parts and the second metal parts by means of chemical plating. During a manufacturing process, the first metal parts and the second metal parts have good flatness, and the cost required for the manufacturing process is relatively low, so that high-density integrated packaging can be carried out, thereby achieving semiconductor interconnect that provides a high efficiency, has a low cost, involves an easily-controlled manufacturing process and has a wide application range.
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Inventors:
CHEN YENHENG (CN)
LIN CHENGCHUNG (CN)
LIN CHENGCHUNG (CN)
Application Number:
PCT/CN2023/097812
Publication Date:
April 25, 2024
Filing Date:
June 01, 2023
Export Citation:
Assignee:
SJ SEMICONDUCTOR JIANGYIN CORP (CN)
International Classes:
H01L21/768
Foreign References:
| CN115332169A | 2022-11-11 | |||
| CN113539859A | 2021-10-22 | |||
| CN113539855A | 2021-10-22 | |||
| CN113555291A | 2021-10-26 | |||
| CN101955152A | 2011-01-26 | |||
| CN114093772A | 2022-02-25 | |||
| US20060249824A1 | 2006-11-09 |
Attorney, Agent or Firm:
J.Z.M.C. PATENT AND TRADEMARK LAW OFFICE (GENERAL PARTNERSHIP) (CN)
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