Title:
POWDER FOR POWDER LAMINATION MOLDING
Document Type and Number:
WIPO Patent Application WO/2022/230807
Kind Code:
A1
Abstract:
A powder that is for powder lamination molding and that contains a resin composition, wherein the resin composition contains an aromatic polyester-based resin, and, when a brittle temperature test prescribed in JIS K7216 is performed on the resin composition at a retention time of 3 minutes at a temperature interval of 5°C, a value of the 50%-impact brittle temperature of the resin composition measured in a range from -70°C to 25°C exists in a range of -45°C to 10°C.
Inventors:
YAMASUE NAO (JP)
KISHISHITA MINORU (JP)
KISHISHITA MINORU (JP)
Application Number:
PCT/JP2022/018723
Publication Date:
November 03, 2022
Filing Date:
April 25, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
MITSUBISHI ENG PLASTICS CORP (JP)
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
B29D29/10; B29C64/153; B33Y70/00; B33Y80/00
Foreign References:
| JPH0940765A | 1997-02-10 | |||
| JP2008050583A | 2008-03-06 | |||
| JP6399165B1 | 2018-10-03 | |||
| JP2021076323A | 2021-05-20 |
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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