Title:
POLYMER FILM LAYER, PREPARATION METHOD THEREFOR, AND LED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/011270
Kind Code:
A1
Abstract:
A polymer film layer, a preparation method therefor, an LED product, a protective LED packaging method, and a protective LED lamp bead. The polymer film layer is formed on the surface of an LED substrate. The polymer film layer is a film layer formed on the surface of the LED substrate by means of a plasma-enhanced chemical vapor deposition method using one or more of a monomer group consisting of an acrylate monomer, a fluorine-containing olefin monomer, an organosilicon monomer, an epoxy monomer and an aromatic ring-containing organic matter monomer as reaction raw materials. The protective LED packaging method comprises the steps of: S110: fixing a light-emitting element to an LED support in a conductive manner; S120: dispensing a glue onto the light-emitting element and the LED support to form a packaging adhesive layer, so as to fabricate an LED semi-finished product; and S130: depositing and forming a polymer film layer on the surface of the LED semi-finished product by means of a plasma-enhanced chemical vapor deposition method to fabricate a protective LED semi-finished product, so as to solve the industry pain point that LED lamp beads are prone to vulcanization, water inflow or oxygen permeation, etc.
More Like This:
Inventors:
ZONG JIAN (CN)
Application Number:
PCT/CN2022/108070
Publication Date:
February 09, 2023
Filing Date:
July 27, 2022
Export Citation:
Assignee:
JIANGSU FAVORED NANOTECHNOLOGY CO LTD (CN)
International Classes:
B05D1/00; H01L33/00
Foreign References:
| CN103068569A | 2013-04-24 | |||
| CN1563243A | 2005-01-12 | |||
| CN106711354A | 2017-05-24 | |||
| CN111570216A | 2020-08-25 | |||
| EP1571475A1 | 2005-09-07 |
Attorney, Agent or Firm:
UNITALEN ATTORNEYS AT LAW (CN)
Download PDF: