Title:
POLYAMIDE RESIN COMPOSITION FOR REFLECTIVE PLATE, AND REFLECTIVE PLATE
Document Type and Number:
WIPO Patent Application WO/2024/004933
Kind Code:
A1
Abstract:
Provided is a polyamide resin composition which is for a reflective plate and from which a reflective plate, that has an excellent adhesion to a sealant used in a light emitting device such as an LED, can be obtained. The polyamide resin composition for a reflective plate includes a polyamide resin (A), an inorganic fiber (B), a colorant (C), and a polyvalent carboxylic acid (D).
Inventors:
KITAJIMA TAKASHI (JP)
Application Number:
PCT/JP2023/023562
Publication Date:
January 04, 2024
Filing Date:
June 26, 2023
Export Citation:
Assignee:
OTSUKA CHEMICAL CO LTD (JP)
International Classes:
C08L77/00; C08K5/092; C08K7/04; F21V7/00; F21V7/24
Domestic Patent References:
| WO2020230805A1 | 2020-11-19 | |||
| WO2003085029A1 | 2003-10-16 |
Foreign References:
| JP2001011309A | 2001-01-16 | |||
| JP5646120B1 | 2014-12-24 | |||
| JP2009155551A | 2009-07-16 | |||
| JP2007271834A | 2007-10-18 | |||
| US20130217813A1 | 2013-08-22 | |||
| JP2014019787A | 2014-02-03 | |||
| JPH11240995A | 1999-09-07 | |||
| JPH06329790A | 1994-11-29 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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