Title:
POLYAMIDE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/282154
Kind Code:
A1
Abstract:
Provided is a polyamide composition which comprises a polyamide, a polyolefin, and a copper-based stabilizer, wherein: the polyolefin contains at least one kind of polyolefin (A) that contains a copolymer of ethylene, alkyl (meth)acrylate, and an unsaturated epoxide and at least one kind of polyolefin (B) that contains an unsaturated dicarboxylic anhydride; the mass ratio [B]/[A] of the content [B] of the polyolefin (B) to the content [A] of the polyolefin (A) is 0.1-2.9; and the value Z calculated by formula (1) is 33-200. Also provided are a production method therefor, use thereof, and a molded body obtained therefrom. Formula (1): Z=1000×(|[ANH]-[EPO]|+[EPO])/X2 [EPO] is the concentration (mmol/kg) of the unsaturated epoxide, which is derived from the polyolefin, per unit mass of the composition. [ANH] is the concentration (mmol/kg) of the unsaturated dicarboxylic anhydride, which is derived from the polyolefin, per unit mass of the composition. The X is the content (mass%) of the polyolefin in the composition.
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Inventors:
SEKIGUCHI KENJI (JP)
Application Number:
PCT/JP2022/026067
Publication Date:
January 12, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08L77/00; C08G69/26; C08K3/16; C08L23/08; C08L23/26
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Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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