Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2024/036983
Kind Code:
A1
Abstract:
A polishing pad (2), comprising a polishing layer (20). The polishing layer (20) comprises a polyurethane substrate, and the polyurethane substrate is obtained by reacting a polyfunctional isocyanate, a polyol composition and a polyamine composition. The polyamine composition comprises one and/or more diamines and/or ternary amines and/or polyamines having more than three elements, the average molecular weight of the polyamine composition is between 200 and 400, the average functionality of the polyamine composition is greater than 2 and does not exceed 2.20, and the ratios of the diamines and the ternary amines in the polyamine composition to the total amount of the polyamine composition are 77%-96%: 3%-12%. The polishing pad has high controllability, relatively low processing condition requirements and a relatively wide processing window, and the formed polishing layer has relatively high service life stability. Further provided are a polyamine composition and a polishing layer.
Inventors:
LUO YIJIE (CN)
CHEN BO (CN)
ZHANG JIPING (CN)
GAO YUE (CN)
LIU MIN (CN)
CAI LONGDAN (CN)
CHEN BO (CN)
ZHANG JIPING (CN)
GAO YUE (CN)
LIU MIN (CN)
CAI LONGDAN (CN)
Application Number:
PCT/CN2023/086148
Publication Date:
February 22, 2024
Filing Date:
April 04, 2023
Export Citation:
Assignee:
HUBEI DINGHUI MICROELECTRONICS MAT CO LTD (CN)
HUBEI DINGLONG CO LTD (CN)
HUBEI DINGLONG CO LTD (CN)
International Classes:
B24B37/24; G01N30/02
Foreign References:
| CN115284166A | 2022-11-04 | |||
| CN107553313A | 2018-01-09 | |||
| CN106891246A | 2017-06-27 | |||
| CN114346894A | 2022-04-15 | |||
| CN114755327A | 2022-07-15 | |||
| US20200215661A1 | 2020-07-09 |
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
Download PDF: