Title:
POLISHING PAD, SUBSTRATE POLISHING DEVICE, AND METHOD FOR MANUFACTURING POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2023/095607
Kind Code:
A1
Abstract:
A substrate polishing device comprising an optical sensor for detecting the state of a substrate surface, wherein the accuracy of detection by the optical sensor is improved. Proposed is a polishing pad for a substrate polishing device comprising an optical sensor. This polishing pad comprises: a pad body of which the surface constitutes a polishing surface, the pad body having a through-hole formed therein; and a window member for allowing passage of sensing light from the optical sensor, the window member being accommodated in the through-hole. The pad body has a surrounding recess that surrounds an edge section defining the through-hole, the surrounding recess being recessed into the polishing surface from the edge section. The surrounding recess communicates with a groove extending in the outer peripheral surface of the polishing pad.
Inventors:
SATORI HIROTAKA (JP)
Application Number:
PCT/JP2022/041628
Publication Date:
June 01, 2023
Filing Date:
November 09, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/20; B24B37/12; B24B37/26; B24B49/12
Domestic Patent References:
| WO2020144911A1 | 2020-07-16 |
Foreign References:
| JP2005032849A | 2005-02-03 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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