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Title:
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2022/210264
Kind Code:
A1
Abstract:
This polishing pad includes: a polyurethane sheet serving as a polishing layer; and an end point detection window provided in an opening in the polyurethane sheet. In a dynamic viscoelasticity measurement of the end point detection window performed under the conditions of a tensile mode, a frequency of 1.0 Hz, and 10 to 100°C, the storage elastic modulus E'W90 at 90°C is 1.0×107 Pa or more, the D hardness (DW80) of the end point detection window at 80°C is 40 or more, and the D hardness (DW20) of the end point detection window at 20°C is from 40 to 90.

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Inventors:
TATENO TEPPEI (JP)
ITOYAMA KOUKI (JP)
SEKIYA HITOSHI (JP)
KOIKE KENICHI (JP)
KURIHARA HIROSHI (JP)
YAMAGUCHI SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
Application Number:
PCT/JP2022/014016
Publication Date:
October 06, 2022
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/24; B24B37/013; C08G18/73; C08G18/75; H01L21/304
Foreign References:
US20190047112A12019-02-14
JP2020519458A2020-07-02
JP2017533585A2017-11-09
JP2009507374A2009-02-19
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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