Title:
POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRATE PROCESSING
Document Type and Number:
WIPO Patent Application WO/2024/036569
Kind Code:
A1
Abstract:
A polishing system (100), a fluid reuse system (500) and a method of polishing a substrate. The polishing system comprises a catch basin (200), a vacuum device (400), and a polishing fluid recycling module (501) for recycling polishing fluid. The catch basin is sized to surround and to abut a polishing pad (104) secured to a platen (102). A radially inward facing surface of the catch basin is further defined by an arc radius which is equal to an arc radius of the platen that the catch basin is sized to surround, the radially inward facing surface of the catch basin configured to allow for a polishing fluid to flow radially outward from the polishing pad into the trough. The systems and method collects and reuses polishing fluid used during a Chemical Mechanical Polishing (CMP) process for manufacturing electronic devices.
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Inventors:
HU JIANJUN (CN)
LIU PENG (CN)
DICKINSON COLIN JOHN (US)
TRUONG QUOC (US)
LEIGHTON JAMIE STUART (US)
PRABHU GOPALAKRISHNA B (US)
GIVENS JOHN HOWARD (US)
LIU PENG (CN)
DICKINSON COLIN JOHN (US)
TRUONG QUOC (US)
LEIGHTON JAMIE STUART (US)
PRABHU GOPALAKRISHNA B (US)
GIVENS JOHN HOWARD (US)
Application Number:
PCT/CN2022/113377
Publication Date:
February 22, 2024
Filing Date:
August 18, 2022
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
HU JIANJUN (CN)
HU JIANJUN (CN)
International Classes:
B24B57/00; B24B1/00; B24B37/04; B24B57/02
Foreign References:
| CN113993661A | 2022-01-28 | |||
| CN1176864A | 1998-03-25 | |||
| US20220193863A1 | 2022-06-23 | |||
| CN1240696A | 2000-01-12 | |||
| EP1052060A2 | 2000-11-15 | |||
| US20020127959A1 | 2002-09-12 |
Attorney, Agent or Firm:
LECOME INTELLECTUAL PROPERTY AGENT LTD. (CN)
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